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A Cooperation Agreement for a Small Versatile 10 Gigabit Transceiver
Package
Issue 2.0b
7th April 2005
 
 
Abstract:                                                                                                       
 
  ...  
 
6. X2 MSA Mechanical
 
     
 
6.1 Introduction to X2 Mechanical Design
 
     
 

This MSA is structured to define a versatile optical transceiver module whose heatsinks, bezels and EMI/gasket solutions can be easily adapted to different application needs Configurations for each application are known in this MSA as "personalities" of X2, for example X2 PCI application has a PCI personality. Personalities may differ in areas such as bezel, heatsink and/or gasketing system.. The system constraints that exist for a given application are known as an environment.
An environment includes such factors as Metal work and airflow details.
The PCB layout and rail system for X2 are shared for all personalities and environments.
The following sections detail:-
     • The X2 personalities and environment for key PCI, front panel and mid board         mounted applications.
     • The X2 base rail and clip on top shield.
     • The PCB layout required for an X2 module and rail.
     • PCI, Switch and other environments addressed by an X2 transceiver.

 
 
 
 
6.2 Description of Latch System
 
 
 
 
The X2 MSA specifies a sleeve style latch system. This provides a robust solution to overcome the forces incurred by the 70 pin electrical connector during extraction. The MSA specifies common grip points for the user. Also specified is a standardized retention feature on the rail system for the module to engage into upon insertion.
 
 
 
 
6.3 Description of the Gasket System
 
     
 
The X2 MSA defines two gasket approaches:-
 
     
 
6.3.1 Overlapping Gasket System
 
     
 
The first provides a bezel that fully overlaps the metal front panel. A compliant gasket is sandwiched between the bezel and the front panel to create a solid EMI solution for all scenarios allowed by the X2 mechanical tolerance stack up. This solution is suitable for highdensity applications such as Ethernet switches.
 
 
6.3.2 PCI Gasket System
 
 
The second EMI solution has been developed for traditional PCI and uses a bevelled face-plate and spring finger or compressible gasket. Such a system gives a robust EMI solution for applications that have restricted face plate area for all scenarios allowed by the X2 mechanical tolerance stack up.
 
 
 
 
6.4 Description of the X2 rail system
 
  ... for more information please go to the X2 MSA page or download  
                                                                                                        (revision 2b 7th April 2005)  
 
 
 
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